eMMC/eMCP Reballing Tool 4 in 1 BGA Stencil

Feature :

1. Use glass fiber for material , avoiding wrist fatigue for long operation ;

2. Moldcore uses high accuracy CNC machining , accurate IC location ;

3. 4 in 1 design in the Steel mesh , capable apply to eMMC153/169 , eMCP162/186 IC reballing at the same time .

4. Moldcore designs with dismountable , easy to change through two screws , change the moldcore can meantime support different size eMMC153/eMCP169 IC reballing .

5. High quality and durable

6. Tested before shipping

7. Easy to use

RM350.00

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Description

Feature :

1. Use glass fiber for material , avoiding wrist fatigue for long operation ;

2. Moldcore uses high accuracy CNC machining , accurate IC location ;

3. 4 in 1 design in the Steel mesh , capable apply to eMMC153/169 , eMCP162/186 IC reballing at the same time .

4. Moldcore designs with dismountable , easy to change through two screws , change the moldcore can meantime support different size eMMC153/eMCP169 IC reballing .

5. High quality and durable

6. Tested before shipping

7. Easy to use

Estimated Delivery Time: 7-14days

 

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