BGA Repair Tools

Showing the single result

Feature : 1. Use glass fiber for material , avoiding wrist fatigue for long operation ; 2. Moldcore uses high accuracy CNC machining , accurate IC location ; 3. 4 in 1 design in the Steel mesh , capable apply to eMMC153/169 , eMCP162/186 IC reballing at the same time . 4. Moldcore designs with dismountable , easy to change through two screws , change the moldcore can meantime support different size eMMC153/eMCP169 IC reballing . 5. High quality and durable 6. Tested before shipping 7. Easy to use
RM350.00
Add to cart
Compare

Showing the single result